JPH0628786Y2 - 電子部品 - Google Patents
電子部品Info
- Publication number
- JPH0628786Y2 JPH0628786Y2 JP1988119331U JP11933188U JPH0628786Y2 JP H0628786 Y2 JPH0628786 Y2 JP H0628786Y2 JP 1988119331 U JP1988119331 U JP 1988119331U JP 11933188 U JP11933188 U JP 11933188U JP H0628786 Y2 JPH0628786 Y2 JP H0628786Y2
- Authority
- JP
- Japan
- Prior art keywords
- nut
- external connection
- terminal
- external
- outer enclosure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 10
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 239000011810 insulating material Substances 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 238000000465 moulding Methods 0.000 description 23
- 238000005192 partition Methods 0.000 description 12
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000009795 derivation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988119331U JPH0628786Y2 (ja) | 1988-09-13 | 1988-09-13 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988119331U JPH0628786Y2 (ja) | 1988-09-13 | 1988-09-13 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0241375U JPH0241375U (en]) | 1990-03-22 |
JPH0628786Y2 true JPH0628786Y2 (ja) | 1994-08-03 |
Family
ID=31364469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988119331U Expired - Lifetime JPH0628786Y2 (ja) | 1988-09-13 | 1988-09-13 | 電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0628786Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5855783Y2 (ja) * | 1979-03-15 | 1983-12-21 | 富士電機株式会社 | 電気機器などのケ−ス |
-
1988
- 1988-09-13 JP JP1988119331U patent/JPH0628786Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0241375U (en]) | 1990-03-22 |
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